The development of wireless electronics, digital systems and mechatronics sciences leads to performant applications in our environment: smart systems, mobile systems, all electrical vehicles, wireless connectivity, aerial and humanoids robots, etc. Theses structures merged because of main progress in material and semi-conductors for electronics, both in digital and power components, and techniques for integration so to keep performances and reliable activity for user’s convenience. But the use of new electronic and electromagnetic technics has scientific drawbacks, that are mainly the rise of electromagnetic interferences and pollutions,and the endless rise of temperature that need to be more and more cooled. They impact on scientific and industrial working policies, because of changing the real conditions of the official state-of-the-art regulatory rules, both for EMC Electromagnetic Compatibility) and Reliabity Standards. This poster will remind basic principles and experimental techniques to investigate and control these severe interferences, to comply with these new problematics: The shift of the range of frequency of conducted and radiated emissions of power and digital electronics, that is denoted the Electromagnetic noises or pollution. The rising of Electromagnetic couplings an interactions, from electronics Chips to Embedded system. It’s called Intra-EMC (couplings inside the system), and Immunity (between complete systems, mobile phone vs robot for example) The impact of real multiphysics conditions (temperature, new materials, Electrostatic Discharges) on the ageing and the real time conditions of Susceptibility(Defaults) and Reliability of a system. For example, electronics boards and processors in automotive with high-temperature environment due to the thermal or electrical motor. Some issues are reviewed to present actual and future scientific challenges for EMC, from electronic circuit level to complete integrated system as mobile phone and robots.