Communication Dans Un Congrès Année : 2019

3D-FE electro-thermo-magnetic modeling of automotive power electronic modules -Wire- bonding and Copper clip technologies comparison

Résumé

In this work, we propose an electromagnetic and thermal 3D-Finit-Element Modeling and simulation methodology, under COMSOL Multiphysics, applied to a phase-leg high current power modules for automotive EV HEV applications, whose technical specifications are similar but with two different interconnection types [1] [2]. This article compares them in terms of stray electrical resistances and inductances but also in terms of thermal resistances and impedances. It will be shown in this article that the introduction of a copper clips only slightly modify the thermal extraction while the electrical performance will be greatly improved.

Fichier principal
Vignette du fichier
Article final.pdf (675.76 Ko) Télécharger le fichier
Origine Fichiers produits par l'(les) auteur(s)
Licence
Loading...

Dates et versions

hal-02157327 , version 1 (16-06-2019)

Licence

Identifiants

  • HAL Id : hal-02157327 , version 1

Citer

Abdoulahad Thiam, Emmanuel Sarraute, William Sanfins, Frédéric Richardeau, Maël Durand. 3D-FE electro-thermo-magnetic modeling of automotive power electronic modules -Wire- bonding and Copper clip technologies comparison. International Workshop on Integrated Power Packaging, Apr 2019, TOULOUSE, France. ⟨hal-02157327⟩
200 Consultations
565 Téléchargements

Partager

  • More