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Communication Dans Un Congrès Année : 2017
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hal-02096949 , version 1 (11-04-2019)

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  • HAL Id : hal-02096949 , version 1

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A. Quelennec, U. Shafique, E Duchesne, H. Fremont, D. Drouin. A highly sensitive humidity sensor integrated to a flip-chip package for moisture detection in electronics package. 5th Micro/Nano-Electronics Packaging and Assembly, May 2017, Grenoble, France. ⟨hal-02096949⟩
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