Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package - Archive ouverte HAL
Proceedings/Recueil Des Communications Année : 2017

Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package

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Sciences de l'ingénieur [physics] Micro et nanotechnologies/Microélectronique

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https://hal.science/hal-02074222

Soumis le : mercredi 20 mars 2019-15:13:58

Dernière modification le : mardi 28 mai 2024-11:48:02

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hal-02074222 , version 1 (20-03-2019)

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Aurore Quelennec, Umar Shafique, Eric Duchesne, Hélène Fremont, Dominique A Drouin. Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package. 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), May 2017, Orlando, United States. IEEE, pp.513-519, 2017, ⟨10.1109/ECTC.2017.140⟩. ⟨hal-02074222⟩

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