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Communication Dans Un Congrès Année : 2018

Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package

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hal-02074111 , version 1 (20-03-2019)

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Aurore Quelennec, Yosri Ayadi, Quentin Vandier, Eric Duchesne, Hélène Fremont, et al.. Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package. 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. pp.1639-1644, ⟨10.1109/ECTC.2018.00247⟩. ⟨hal-02074111⟩
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