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Communication Dans Un Congrès Année : 2016

High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer

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hal-01992951 , version 1 (24-01-2019)

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Khadim Dieng, Cédric Bermond, Philippe Artillan, Olivier Guiller, Thierry Lacrevaz, et al.. High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer. 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), May 2016, Turin, Italy. pp.1-4, ⟨10.1109/SaPIW.2016.7496285⟩. ⟨hal-01992951⟩
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