Highlighting two integration technologies based on vias: Through Silicon Vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability - Archive ouverte HAL
Communication Dans Un Congrès Année : 2018

Highlighting two integration technologies based on vias: Through Silicon Vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability

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Electronique

Isabelle Bord  : Connectez-vous pour contacter le contributeur

https://hal.science/hal-01957288

Soumis le : lundi 17 décembre 2018-11:26:56

Dernière modification le : lundi 5 juin 2023-16:52:11

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hal-01957288 , version 1 (17-12-2018)

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  • HAL Id : hal-01957288 , version 1

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Mickaël Balmont, Isabelle Bord Majek, B. Poupard, Laurent Bechou, Yves Ousten. Highlighting two integration technologies based on vias: Through Silicon Vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. 29th European Symposium on Relaibility of Electron Devices, Failure Physics and Analysis, ESREF 2018, Oct 2018, Aalborg, Denmark. ⟨hal-01957288⟩

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CNRS IMS-BORDEAUX IMS-BORDEAUX-FUSION SEEDS-GT-PCB
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