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Communication Dans Un Congrès Année : 2018

Highlighting two integration technologies based on vias: Through Silicon Vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability

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Electronique
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hal-01957288 , version 1 (17-12-2018)

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  • HAL Id : hal-01957288 , version 1

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Mickaël Balmont, Isabelle Bord Majek, B. Poupard, Laurent Bechou, Yves Ousten. Highlighting two integration technologies based on vias: Through Silicon Vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. 29th European Symposium on Relaibility of Electron Devices, Failure Physics and Analysis, ESREF 2018, Oct 2018, Aalborg, Denmark. ⟨hal-01957288⟩
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