Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device. - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2018

Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device.

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Electronique
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Dates et versions

hal-01957025 , version 1 (17-12-2018)

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  • HAL Id : hal-01957025 , version 1

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Mickaël Balmont, Isabelle Bord Majek, Yves Ousten. Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device.. 7th Electronic System-Integration Technology Conference, ESTC 2018, Sep 2018, Dresden, Germany. ⟨hal-01957025⟩
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