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            <title xml:lang="en">AlN/ZnO/LiNbO 3 Packageless Structure as a Low-Profile Sensor for Potential On-Body Applications</title>
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            <funder>ACKNOWLEDGMENTThe authors would like to thank L. Badie, G. Lengaigne, and F. Montaigne from Minalor platform, Institut Jean Lamour, Nancy, France, for their help in the microfabrication.</funder>
            <funder>This work was supported in part by the Direction Générale de l’Armement, in part by the Région Grand-Est, in part by the European funds FEDER, in part by the French PIA project “Lorraine Université d’Excellence” under Grant ANR-15-IDEX-04-LUE, and in part by the Ministry of Science and Education of Russian Federation under Grant 8.6108.2017/6.7.</funder>
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                <title level="j">IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control</title>
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                  <publisher>Institute of Electrical and Electronics Engineers</publisher>
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              <p>Surface acoustic wave (SAW) sensors find their application in a growing number of fields. This interest stems in particular from their passive nature and the possibility of remote interrogation. Still, the sensor package, due to its size, remains an obstacle for some applications. In this regard, packageless solutions are very promising. This paper describes the potential of the AlN/ZnO/LiNbO3 structure for packageless acoustic wave sensors. This structure, based on the waveguided acoustic wave principle, is studied numerically and experimentally. According to the COMSOL simulations, a wave, whose particle displacement is similar to a Rayleigh wave, is confined within the structure when the AlN film is thick enough. This result is confirmed by comprehensive experimental tests, thus proving the potential of this structure for packageless applications, notably temperature sensing. Index Terms-Surface acoustic wave SAW, temperature sensor, waveguiding layer acoustic wave WLAW, packageless, low-profile.</p>
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