3D Hybrid Bonding assembly studied by Scanning Thermal Microscopy, resistive thermometry and Finite Element Modelling - Archive ouverte HAL
Communication Dans Un Congrès Année : 2018

3D Hybrid Bonding assembly studied by Scanning Thermal Microscopy, resistive thermometry and Finite Element Modelling

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Thermique [physics.class-ph]

Pierre-Olivier Chapuis  : Connectez-vous pour contacter le contributeur

https://hal.science/hal-01932476

Soumis le : vendredi 23 novembre 2018-09:37:06

Dernière modification le : mardi 3 septembre 2024-11:16:05

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Dates et versions

hal-01932476 , version 1 (23-11-2018)

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  • HAL Id : hal-01932476 , version 1

Citer

Axel Pic, Rafael Augusto Prieto Herrera, Sebastien Gallois-Garreignot, Jean-Philippe Colonna, Vincent Fiori, et al.. 3D Hybrid Bonding assembly studied by Scanning Thermal Microscopy, resistive thermometry and Finite Element Modelling. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2018, Toulouse, France. ⟨hal-01932476⟩

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