Processing of Back Surface of Si Wafers With a Pulsed Nd:YAG Laser - Archive ouverte HAL
Article Dans Une Revue Journal of Laser Micro/Nanoengineering Année : 2016

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hal-01914433 , version 1 (06-11-2018)

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Neng Liu, Moumanis Khalid, Vincent Jonathan, Jan J. Dubowski. Processing of Back Surface of Si Wafers With a Pulsed Nd:YAG Laser. Journal of Laser Micro/Nanoengineering, 2016, 11 (2), pp.232 - 238. ⟨10.2961/jlmn.2016.02.0014⟩. ⟨hal-01914433⟩
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