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Article Dans Une Revue IEEE Microwave and Wireless Components Letters Année : 2018

High-Performance Compact 3-D Solenoids for RF Applications

Résumé

A cost-effective technology is proposed for the integration of very compact and high-performance 3-D solenoid inductors. Based on a two metal level process, it involves a 3-D copper electroplating step for simultaneous integration of vertical and upper sections of coils. Several solenoids fabricated on a glass substrate and ranging from 2.3 nH to 9.5 nH are presented. The best performance is experimentally achieved by a 3-turn 3 nH inductor showing a maximum Q-factor of 58 at 5.6 GHz and a self-resonant frequency of 19 GHz. The best inductance density of 63 nH/mm 2 is reached by an 8-turn 9.5 nH solenoid.
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Dates et versions

hal-01778992 , version 1 (26-04-2018)
hal-01778992 , version 2 (08-05-2018)
hal-01778992 , version 3 (02-10-2018)

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Audrey Cayron, Christophe Viallon, Olga Bushueva, Ayad Ghannam, Thierry Parra. High-Performance Compact 3-D Solenoids for RF Applications. IEEE Microwave and Wireless Components Letters, 2018, 28 (6), pp.479-481. ⟨10.1109/LMWC.2018.2831438⟩. ⟨hal-01778992v3⟩
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