Mapping stress and strain in nanostructures by high-resolution transmission electron microscopy - Archive ouverte HAL
Article Dans Une Revue Microelectronic Engineering Année : 2007

Mapping stress and strain in nanostructures by high-resolution transmission electron microscopy

Résumé

We present the current state-of-the-art of geometric phase analysis (GPA), a technique for measuring stress and strain at the nanoscale by high-resolution transmission electron microscopy (HRTEM). The method will be illustrated with an experimental study of SiGe strained layers using the SACTEM-Toulouse, an aberration-corrected transmission electron microscope. This latest generation machine improves signal-to-noise allowing deformations to be measured to an accuracy of 0.1% at nanometre scale resolution. The relation between strain and deformation will be discussed in the light of thin film relaxation and chemical interdiffusion.

Dates et versions

hal-01741980 , version 1 (23-03-2018)

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Citer

Florent Houdellier, Martin Hÿtch. Mapping stress and strain in nanostructures by high-resolution transmission electron microscopy. Microelectronic Engineering, 2007, 84 (3), pp.460 - 463. ⟨10.1016/j.mee.2006.10.062⟩. ⟨hal-01741980⟩
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