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Article Dans Une Revue Comptes Rendus. Physique Année : 2014

In situ mechanical TEM: Seeing and measuring under stress with electrons

Résumé

From the first observation of moving dislocations in 1956 to the latest developments of piezo-actuated sample holders and direct electron sensing cameras in modern transmission electron microscopes (TEM), in situ mechanical testing has brought an unequaled view of the involved mechanisms during the plastic deformation of materials. Although MEMS-based or load-cell equipped holders provide an almost direct measure of these quantities, deriving stress and strain from in situ TEM experiments has an extensive history. Nowadays, the realization of a complete mechanical test while observing the evolution of a dislocation structure is possible, and it constitutes the perfect combination to explore size effects in plasticity. New cameras, data acquisition rates and intrinsic image-related techniques, such as holography, should extend the efficiency and capabilities of in situ deformation inside a TEM.
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hal-01729251 , version 1 (12-03-2018)

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Marc Legros. In situ mechanical TEM: Seeing and measuring under stress with electrons. Comptes Rendus. Physique, 2014, 15 (2-3), pp.224-240. ⟨10.1016/j.crhy.2014.02.002⟩. ⟨hal-01729251⟩
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