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Article Dans Une Revue Journal of Vacuum Science and Technology Année : 2016

Selective dry etching of TiN nanostructures over SiO2 nanotrenches using a Cl2/Ar/N2 inductively coupled plasma

Résumé

An inductively coupled plasma etch process for the fabrication of TiN nanostructures over nanotopography is presented. Using a Cl2/Ar/N2 plasma, a selectivity of 50 is achieved over SiO2. The effect of N2 flow rate on the etch rates and the nonvolatile residues on TiN sidewalls is investigated. As N2 flow rate is increased up to 50 sccm, a change in the deposition of the nonvolatile residues on TiN sidewalls is observed. The current density–voltage characterizations of TiN devices fabricated with TiN nanostructure sidewalls are presented. The measured current densities of two different samples etched with low and high N2 flow rate, respectively, demonstrated the presence after cleaning of an insulating layer deposited on the sidewalls for low N2 flow rate only.

Dates et versions

hal-01701405 , version 1 (05-02-2018)

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Citer

Bruno Lee Sang, Marie-Josée Gour, Maxime Darnon, Serge Ecoffey, Abdelatif Jaouad, et al.. Selective dry etching of TiN nanostructures over SiO2 nanotrenches using a Cl2/Ar/N2 inductively coupled plasma. Journal of Vacuum Science and Technology, 2016, 34 (2), ⟨10.1116/1.4936885⟩. ⟨hal-01701405⟩
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