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Article Dans Une Revue Journal of Microelectronics and Electronic Packaging Année : 2017

Evaluation of printed-circuit boards materials for high temperature operation

Résumé

This article presents the long term (1000 h) behaviour of two printed-circuit board materials (Panasonic R1755V, a high-T G glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190 °C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regu- larly (once per week). Almost no degradation is observed for both materials, when stored in nitrogen. On the contrary, the board stored in air show the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 weeks, because of large swelling
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Dates et versions

hal-01674483 , version 1 (02-01-2018)

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Oriol Aviño Salvado, Wissam Sabbah, Cyril Buttay, Hervé Morel, Pascal Bevilacqua. Evaluation of printed-circuit boards materials for high temperature operation. Journal of Microelectronics and Electronic Packaging, 2017, 14 (4), ⟨10.4071/imaps.516313⟩. ⟨hal-01674483⟩
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