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Communication Dans Un Congrès Année : 2017

Comparative FEM thermo-mechanical simulations for built-in reliability: surface mounted technology versus embedded technology for silicon dies

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Electronique
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hal-01593354 , version 1 (26-09-2017)

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  • HAL Id : hal-01593354 , version 1

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Mickaël Balmont, Isabelle Bord Majek, Yves Ousten. Comparative FEM thermo-mechanical simulations for built-in reliability: surface mounted technology versus embedded technology for silicon dies. 21st European Microelectronics ans Packaging Conference (EMPC 2017), Sep 2017, Warsaw, Poland. pp.150. ⟨hal-01593354⟩
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