With the growing number of cores on chips, conventional electrical interconnects reach scalability limits, leading the way for alternatives like Radio Frequency (RF), optical and 3D. Due to the variability of applications, communication needs change over time and across regions of the chip. To address these issues, we propose a dynamically reconfigurable Network on Chip (NoC) based on RF. We study the feasibility of the NoC on the basis of state of the art components. Furthermore, RF-NoC and electrical mesh communication latency are comparable for 256 nodes but RF becomes faster for wider networks.