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Communication Dans Un Congrès Année : 2017

On the co-integration of a thermo-resistive flow-rate sensor in a multi-parameter sensing chip for water network monitoring

Résumé

Motivated by the need for a multi-parameter sensing chip for water networks monitoring, we address here the specific case of a flow-rate sensor where the main challenge is the substrate material. Instead of using conventional low thermal conductivity materials such as glass, silicon has to be used. Indeed, a silicon substrate enables the co-integration of various kinds of sensors on the same chip as reported in this contribution. However, it increases the flow-rate sensor power consumption due to larger thermal leaks. We therefore design and study an optimized low power micro-machined thermal flow-rate sensor based on a silicon substrate and operating according to hot-wire anemometry. It can be considered as an alternative to other well established sensors for liquid flow-rate measurement when both the use of a silicon substrate and a low power consumption are needed.
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Dates et versions

hal-01578963 , version 1 (30-08-2017)

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Shaun Ferdous, E. Nefzaoui, Hugo Regina, William Cesar, Frederic Marty, et al.. On the co-integration of a thermo-resistive flow-rate sensor in a multi-parameter sensing chip for water network monitoring . 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2017), Jun 2017, Kaohsiung, Taiwan. pp.1069-1072, ⟨10.1109/TRANSDUCERS.2017.7994237⟩. ⟨hal-01578963⟩
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