Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling
Résumé
We investigate the effect of three testing conditions (thermal shock, Rapid Temperature Changes – RTC – and high temperature storage) on the interconnects of a power electronic module. In particular, the mechanical strength of thick aluminium wirebonds is investigated and shows that while it is not affected by storage at 230 °C, it is much more sensitive to thermal cycling. Shock tests are found to be especially severe, despite having a smaller temperature swing than RTC. Regarding the die attach, no noticeable reduction in mechanical strength is found, regardless of the ageing conditions, and despite clear micro-structural evolutions.
Domaines
Sciences de l'ingénieur [physics]| Origine | Fichiers produits par l'(les) auteur(s) |
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