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Article Dans Une Revue Microelectronics Reliability Année : 2017

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling

Résumé

We investigate the effect of three testing conditions (thermal shock, Rapid Temperature Changes – RTC – and high temperature storage) on the interconnects of a power electronic module. In particular, the mechanical strength of thick aluminium wirebonds is investigated and shows that while it is not affected by storage at 230 °C, it is much more sensitive to thermal cycling. Shock tests are found to be especially severe, despite having a smaller temperature swing than RTC. Regarding the die attach, no noticeable reduction in mechanical strength is found, regardless of the ageing conditions, and despite clear micro-structural evolutions.
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Dates et versions

hal-01562549 , version 1 (15-07-2017)

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Wissam Sabbah, Faical Arabi, Oriol Aviño Salvado, Cyril Buttay, Loic Théolier, et al.. Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling. Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.091⟩. ⟨hal-01562549⟩
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