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Communication Dans Un Congrès Année : 2017

Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronic Packages

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hal-01552809 , version 1 (03-07-2017)

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  • HAL Id : hal-01552809 , version 1

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A. Quelennec, U. Shafique, E. Duchesne, H. Frémont, D. Drouin. Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronic Packages. IEEE Electronic Components and Technology Conference, May 2017, Orlando, United States. ⟨hal-01552809⟩
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