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Article Dans Une Revue Quality and Reliability Engineering International Année : 1996

Laser probe measurements of quality evolution of solder joints during thermal cycling ageing tests

Résumé

We present the results of a non‐destructive measuring method allowing us to characterize the evolution of solder joints during thermal cycling ageing tests. The method uses a high resolution optical probe to detect selectively pure Joule and Peltier thermal responses of the solder joint subject to a given current pulse. The results show the Peltier and Joule responses to be good indicators for the evaluation of the age and the degradation of solder joints.

Dates et versions

hal-01550076 , version 1 (29-06-2017)

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Citer

V. Quintard, B. Parmentier, T. Phan, D. Lewis, S. Dilhaire, et al.. Laser probe measurements of quality evolution of solder joints during thermal cycling ageing tests. Quality and Reliability Engineering International, 1996, 12 (6), pp.447-452. ⟨10.1002/(SICI)1099-1638(199611)12:6<447::AID-QRE66>3.0.CO;2-L⟩. ⟨hal-01550076⟩
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