Substrate integrated suspended line to air-filled SIW transition for high-performance millimeter-wave multilayer integration
Résumé
Substrate integrated suspended line (SISL) and air-filled sub-strate integrated waveguide (AFSIW) technological platforms have been recently reported. They are both of high interest in the design of high-performance integrated millimeter-wave systems based on low-cost multilayer printed circuit board (PCB) technologies. This has been confirmed through simula-tions and experiments when comparing the insertion loss at Ka-band of the SISL and AFSIW with other conventional transmis-sion lines. To take advantage of both platforms and interconnect SISL and AFSIW structures and circuits, a broadband SISL to AFSIW transition is reported. For demonstration purpose, a back-to-back transition operating over the Ka-band has been designed and fabricated. It achieves a matching of better than -15 dB and an insertion loss of 0.27 ±0.22 dB (0.11 ±0.06 dB for the transition) over the Ka-band.