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Article Dans Une Revue Materials Science Forum Année : 2016

Vertical Termination Filled with Adequate Dielectric for SiC Devices in HVDC Applications

Résumé

Recently, thanks to the advancement in SiC process technology, the deep trench termination (DT2) technique becomes an appropriate choice for future high voltage SiC power device. This technique termination is based on the use of a wide and deep trench, which is filled by a dielectric and associated with a field plate. DT2 technique increases the breakdown voltage (VBR) to a value near to the ideal one that can be obtained in a plan case; and at the same time, reduces drastically the chip area comparing to the previous conventional techniques. In this work, the DT2 used for a 3 kV 4H-SiC bipolar vertical diode is presented. Simulations using TCAD SENTAURUS software show that a maximum breakdown voltage of 3286 V at room temperature can be achieved with a deep trench of 20μm corresponding to 98 % of a parallel plane breakdown voltage for the drift layer of 18 μm. Those simulations also point out the important impact of the structure of the trench; the dielectric critical electric filled (Ec), the permittivity (εr) of the dielectric filled, etching defects as microtrench, fixed charges at the interfaces...on the VBR of power device.

Domaines

Electronique
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Dates et versions

hal-01391838 , version 1 (06-05-2019)

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Thi Thanh Huyen Nguyen, Mihai Lazar, Jean-Louis Augé, Hervé Morel, Luong Viet Phung, et al.. Vertical Termination Filled with Adequate Dielectric for SiC Devices in HVDC Applications. Materials Science Forum, 2016, 858, pp.982-985. ⟨10.4028/www.scientific.net/MSF.858.982⟩. ⟨hal-01391838⟩
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