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Communication Dans Un Congrès Année : 2016

Multilayer-Substrate Integration Technique of Air-Filled Waveguide Circuits

Résumé

This paper presents Air-Filled Substrate Integrated Waveguide (AFSIW) intended for the design of high performance and low-cost systems based on multilayer Printed Circuit Board (PCB) process. The top and bottom layer may make use of an extremely low-cost standard substrate such as FR-4 on which base-band or digital circuits can be implemented so to obtain a self-packaged and compact millimeter-wave integrated system.
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Dates et versions

hal-01349572 , version 1 (28-07-2016)

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Citer

Anthony Ghiotto, Frédéric Parment, Tan-Phu Vuong, Ke Wu. Multilayer-Substrate Integration Technique of Air-Filled Waveguide Circuits. 2016 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), Jul 2016, Beijing, China. ⟨10.1109/NEMO.2016.7561664⟩. ⟨hal-01349572⟩
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