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Communication Dans Un Congrès Année : 2015

Reliability in Power Modules Die Attach: A Comprehensive Evolution of the Nanocrystalline Silver Sintering Physical Properties Versus its Porosity

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hal-01333190 , version 1 (16-06-2016)

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  • HAL Id : hal-01333190 , version 1

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Toni Youssef, Wafaa Rmili, Eric Woirgard, Stephane Azzopardi, Nicolas Vivet, et al.. Reliability in Power Modules Die Attach: A Comprehensive Evolution of the Nanocrystalline Silver Sintering Physical Properties Versus its Porosity. 26th European Symposium on Reliability of Electron Devices, Oct 2015, Toulouse, France. ⟨hal-01333190⟩
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