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Communication Dans Un Congrès Année : 2016

Enhancement of VCSEL performances using a novel bonding process based on localized electroplating copper through Silicon vias

Résumé

The development of power efficient vertical-cavity surface-emitting lasers (VCSELs) in the 1.55µm range, with relatively high output power (>1mW) and enhanced thermal dissipation is still challenging, but would represent a real breakthrough for the scientific community, with important perspectives in different areas of fundamental research and applied physics (WDM and FTTH networks, gas sensing and deformation detectors, microwaves, etc.). In this context, a novel bonding technique is presented in this work. It relies on the use of a BCB polymer bonding to virtually report any material on a Si host platform, through the use of Cu-filled vias acting as µ-heat sinks. This so-called Through Silicon Holes Electroplated Copper (TSHEC) technique has undoubtedly several advantages, since it allows a hybrid integration of III-V active regions on a Si substrate (for photonics, microelectronics, microfluidics integration), it avoids stress-induced limitation with respect of standard large Cu surface solutions, and it is cost-effective. Moreover, it is fully compatible with optical pumping as well as electrical injection schemes. This approach has been recently validated in the case of InP-based OP-VCSEL structures, for which an emission power exceeding 2mW with a threshold as low as 7mW at 20°C has been demonstrated, in the case of a bottom hybrid metal-dielectric Bragg mirror (H-DBR) of 20µm in diameter. Different diameter sizes for the bottom H-DBR have been tested, ranging from 20µm up to 100µm. According to the size of the H-DBR, different values for the output power have been measured, together with a red shift of the laser emission, which are related to different values for the thermal impedance of the devices.
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Dates et versions

hal-01328020 , version 1 (13-06-2017)

Identifiants

  • HAL Id : hal-01328020 , version 1

Citer

Salvatore Pes, Fethallah Taleb, Cyril Paranthoen, Christophe Levallois, Nicolas Chevalier, et al.. Enhancement of VCSEL performances using a novel bonding process based on localized electroplating copper through Silicon vias. 9th European Workshop on VCSELs (VCSEL Day 2016), TU Darmstadt, Jun 2016, Darmstadt, Germany. ⟨hal-01328020⟩
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