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Article Dans Une Revue IEEE Transactions on Components, Packaging and Manufacturing Technology Année : 2015

Miniaturized C-Band SIW Filters Using High-Permittivity Ceramic Substrates

Michel Le Coq
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  • PersonId : 920849
Eric Rius
Jean-François Favennec
Cédric Quendo
Benjamin Potelon
Abbas El Mostrah
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  • PersonId : 944814

Résumé

This paper introduces an effective way to build efficient miniature C-band filters using high-permittivity ceramics. The objective was to evaluate the feasibility of such filters using commercial electromagnetic simulators and a conventional fabrication process. For the demonstration, the substrate integrated waveguide (SIW) technology was chosen. Compared with planar solutions, this configuration offers good quality factors and good electrical performances as a consequence. However, its dimensions are large, leading to unacceptably large footprints for many applications. The solution proposed in this paper is based on a ceramic substrate with a permittivity of 90, which allowed us to work with shorter wavelengths. In comparison with a standard alumina substrate (permittivity εr = 9.9), this approach makes it possible to reduce the footprint up to nine times. Two prototypes were realized on a Trans-Tech ceramic substrate (thickness = 635 μm, εr = 90, and tanδ = 9 · 10−4). The first prototype is a folded sixth-order SIW filter including a cross coupling combining coplanar waveguide probes and a thin microstrip line on an InterVia substrate. The second one is a folded eighth-order SIW filter without cross couplings. Here, we compare the sixth-order prototype with an identical one built on alumina. The eighth-order filter, which had no alumina counterpart, is a potentially useful alternative for situations where complex technological steps must be avoided.
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Dates et versions

hal-01300241 , version 1 (09-04-2016)

Identifiants

  • HAL Id : hal-01300241 , version 1

Citer

Michel Le Coq, Eric Rius, Jean-François Favennec, Cédric Quendo, Benjamin Potelon, et al.. Miniaturized C-Band SIW Filters Using High-Permittivity Ceramic Substrates. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5 (5), pp.620-626. ⟨hal-01300241⟩
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