Parametric exploration of vertical tapered coupler for 3D optical interconnection
Résumé
In this paper, we numerically investigate tapered waveguide couplers for vertical interconnection. Three different platforms enabling 3D stacking of optical circuitry are considered: crystalline silicon over crystalline silicon, amorphous silicon over crystalline silicon and silicon nitride over crystalline silicon. The performance in terms of insertion loss are evaluated and discussed.
| Origine | Fichiers produits par l'(les) auteur(s) |
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