Article Dans Une Revue IEEE Sensors Journal Année : 2013

Packageless AlN/ZnO/Si Structure for SAW Devices Applications

Ouarda Legrani
  • Fonction : Auteur
  • PersonId : 767801
  • IdRef : 172257980
Omar Elmazria
Sergei Zhgoon
  • Fonction : Auteur
Philippe Pigeat
  • Fonction : Auteur
  • PersonId : 935953
Ausrine Bartasyte

Résumé

The possibility to perform a packageless structure for acoustic wave sensors applications based on AlN/interdigital transducer/ZnO/Si structure was investigated. The effect of thicknesses of AlN and ZnO thin films on structure performance was simulated by 2-D finite element method. Theoretical predictions were confirmed by in-situ measurements of frequency, insertion loss, and thickness during deposition of AlN layer on ZnO/Si.

Fichier non déposé

Dates et versions

hal-01283888 , version 1 (07-03-2016)

Identifiants

Citer

Ouarda Legrani, Omar Elmazria, Sergei Zhgoon, Philippe Pigeat, Ausrine Bartasyte. Packageless AlN/ZnO/Si Structure for SAW Devices Applications. IEEE Sensors Journal, 2013, 13 (2), pp.487-491. ⟨10.1109/JSEN.2012.2219692⟩. ⟨hal-01283888⟩
98 Consultations
0 Téléchargements

Altmetric

Partager

  • More