EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
Résumé
In this paper, the signal integrity (SI) and Electromagnetic Compatibility (EMC) performance of System-On-Chip (SoC) and stacked memory using Package-On-Package (PoP) technology is investigated. The reconfiguration of the IC-EMC software platform to PoP is described. From an existing 2D assembly using a discrete 65-nm SoC product, the benefits of PoP integration using a next-generation 28-nm product with stacked memory are analyzed, based on simulation and predictive analysis performed using IC-EMC software platform.
Domaines
Electronique| Origine | Fichiers produits par l'(les) auteur(s) |
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