Highly integrated power electronic converters using active devices embedded in printed-circuit board
Résumé
In this paper, we present a short overview of the power dies interconnects based on PCB technology, then we focus on embedding of power dies in the PCB material. In the second part of the article, we present in details the technology we developed to embed dies in PCB. Results show that the electrical performance of the die remains satisfying after embedding, but that dies with a copper topside metal layer are required for this process.
Domaines
Sciences de l'ingénieur [physics]
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article.pdf (4.72 Mo)
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presentation.pdf (6.39 Mo)
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| Origine | Fichiers produits par l'(les) auteur(s) |
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| Origine | Fichiers produits par l'(les) auteur(s) |
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