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Communication Dans Un Congrès Année : 2015

Highly integrated power electronic converters using active devices embedded in printed-circuit board

Résumé

In this paper, we present a short overview of the power dies interconnects based on PCB technology, then we focus on embedding of power dies in the PCB material. In the second part of the article, we present in details the technology we developed to embed dies in PCB. Results show that the electrical performance of the die remains satisfying after embedding, but that dies with a copper topside metal layer are required for this process.

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Dates et versions

hal-01197043 , version 1 (11-09-2015)

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  • HAL Id : hal-01197043 , version 1

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Chenjiang Yu, Cyril Buttay, Eric Labouré, Vincent Bley, Céline Combettes. Highly integrated power electronic converters using active devices embedded in printed-circuit board. 4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France. ⟨hal-01197043⟩
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