Failure Analysis of ESD-stressed SiC MESFET - Archive ouverte HAL
Article Dans Une Revue Microelectronics Reliability Année : 2015

Failure Analysis of ESD-stressed SiC MESFET

Résumé

Reliability studies are required for SiC device development. In a previous work we studied the intrinsic ESD robustness of a SiC MESFET. The failure mechanism was related to the triggering of an NPN parasitic transistor. In this work, a new MESFET layout is considered, which optionally include a Zener diode for internal protection. TLP testing and failure analysis has been carried out. Two new failure mechanisms are evidenced. Based on this knowledge, solutions are proposed to further improve the ESD robustness.

Mots clés

Domaines

Electronique
Fichier principal
Vignette du fichier
esref2015_paper_191_3.pdf (4.04 Mo) Télécharger le fichier
Origine Fichiers produits par l'(les) auteur(s)

Dates et versions

hal-01176674 , version 1 (17-07-2015)

Identifiants

Citer

Tanguy Phulpin, David Trémouilles, Karine Isoird, Dominique Tournier, Philippe Godignon, et al.. Failure Analysis of ESD-stressed SiC MESFET. Microelectronics Reliability, 2015, 55 (9-10), pp.1542-1548. ⟨10.1016/j.microrel.2015.06.121⟩. ⟨hal-01176674⟩
239 Consultations
387 Téléchargements

Altmetric

Partager

More