Microstructural design of new high conductivity – high strength Cu-based alloy - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Journal of Alloys and Compounds Année : 2015

Microstructural design of new high conductivity – high strength Cu-based alloy

Résumé

Some novel high conductivity–high strength materials were designed in the binary Cu–Mg. They exhibit an excellent balance between strength and electrical properties. The properties and the performance of the designed materials are compared with the main Cu-based alloys and the analysis shows that they perform equally to the best one (Cu–Be). Furthermore, we show that an increase of Mg content modifies the microstructure feature and leads to a strong increase of strength without any significant deterioration of the electrical conductivity. This behavior was attributed to the formation of eutectic islands in which high density of Cu2Mg nanoparticles precipitate.

Domaines

Matériaux
Fichier principal
Vignette du fichier
2015-030.pdf (1.58 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-01122713 , version 1 (09-01-2019)

Licence

Paternité - Pas d'utilisation commerciale - Pas de modification

Identifiants

Citer

Stéphane Gorsse, Blanche Ouvrard, Mohamed Gouné, Angeline Poulon-Quintin. Microstructural design of new high conductivity – high strength Cu-based alloy. Journal of Alloys and Compounds, 2015, 633, pp.42-47. ⟨10.1016/j.jallcom.2015.01.234⟩. ⟨hal-01122713⟩
71 Consultations
301 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More