Communication Dans Un Congrès Année : 2014

Broadband transition from dielectric-filled to air-filled Substrate Integrated Waveguide for low loss and high power handling millimeter-wave Substrate Integrated Circuits

Résumé

Air-filled Substrate Integrated Waveguide (SIW) based on multilayer Printed Circuit Board (PCB) process is proposed in this paper for millimeter-wave applications that require low cost, high performances and compactness. This air-filled SIW allows for substantial loss reduction and power handling enhancement. Its fabrication involves three layers. The top and bottom substrates can consist of a low cost standard substrate such as FR-4 on which base-band or digital circuits can be implemented so to obtain a very compact, high performance and low cost millimeter-wave system. At Ka-band, it is shown that air-filled SIW compared to dielectric-filled SIW based on Rogers RT/Duroid 5880 and 6002 reduces losses by a mean value of 0.054 dB/cm and 0.11 dB/cm and increases average power handling capability by 6 dB and 8 dB, respectively. To allow interconnects of the proposed air-filled SIW with dielectric-filled SIW, a broadband transition is presented. The design steps of this transition are detailed. For demonstration purposes, a back-to-back transition operating over the Ka-band is fabricated. It achieves a matching of better than -15 dB and an insertion loss of 0.6 ±0.2 dB (0.3 ±0.1 dB for the transition) from 27 to 40 GHz.

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Dates et versions

hal-01088910 , version 1 (29-11-2014)

Identifiants

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Frédéric Parment, Anthony Ghiotto, Tan-Phu Vuong, Jean-Marc Duchamp, Ke Wu. Broadband transition from dielectric-filled to air-filled Substrate Integrated Waveguide for low loss and high power handling millimeter-wave Substrate Integrated Circuits. Microwave Symposium (IMS), 2014 IEEE MTT-S International, IEEE, Jun 2014, tampa, United States. ⟨10.1109/MWSYM.2014.6848524⟩. ⟨hal-01088910⟩
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