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Article Dans Une Revue IEEE Microwave and Wireless Components Letters Année : 2014

Broadband E-Plane Junction for Three-Dimensional Substrate Integrated Waveguide Circuits and Systems

Ali Doghri
Tarek Djerafi
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Ke Wu
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Résumé

E-plane out-of-phase junction is proposed for three-dimensional (3-D) substrate integrated waveguide (SIW) circuits and systems. Its fabrication is made with low-cost printed circuit board (PCB) process and Lego-style planar building blocks. The proposed structure is validated through the simulation and measurement of an experimental E-plane junction operating from 30 to 40 GHz (28% bandwidth). Over this broadband frequency range, the fabricated prototype shows excellent performances with measured return loss, insertion loss and phase imbalance of better than 16 dB, 0.46 dB, and ±3°, respectively. An integrated wideband dual-polarized array feed is designed and demonstrated on the basis of the proposed E-plane junction. The fabricated array achieves measured isolation of larger than 26 dB and return loss of better than -10.6 dB, with gains of 14 and 14.6 dBi at 35 GHz, respectively, for the vertical and horizontal radiation patterns.
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Dates et versions

hal-01088909 , version 1 (29-11-2014)

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Citer

Ali Doghri, Anthony Ghiotto, Tarek Djerafi, Ke Wu. Broadband E-Plane Junction for Three-Dimensional Substrate Integrated Waveguide Circuits and Systems. IEEE Microwave and Wireless Components Letters, 2014, 24 (11), pp.739-741. ⟨10.1109/LMWC.2014.2350258⟩. ⟨hal-01088909⟩
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