<?xml version="1.0" encoding="utf-8"?>
<TEI xmlns="http://www.tei-c.org/ns/1.0" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:hal="http://hal.archives-ouvertes.fr/" xmlns:gml="http://www.opengis.net/gml/3.3/" xmlns:gmlce="http://www.opengis.net/gml/3.3/ce" version="1.1" xsi:schemaLocation="http://www.tei-c.org/ns/1.0 http://api.archives-ouvertes.fr/documents/aofr-sword.xsd">
  <teiHeader>
    <fileDesc>
      <titleStmt>
        <title>HAL TEI export of hal-01065293</title>
      </titleStmt>
      <publicationStmt>
        <distributor>CCSD</distributor>
        <availability status="restricted">
          <licence target="https://creativecommons.org/publicdomain/zero/1.0/">CC0 1.0 - Universal</licence>
        </availability>
        <date when="2026-05-22T14:41:23+02:00"/>
      </publicationStmt>
      <sourceDesc>
        <p part="N">HAL API Platform</p>
      </sourceDesc>
    </fileDesc>
  </teiHeader>
  <text>
    <body>
      <listBibl>
        <biblFull>
          <titleStmt>
            <title xml:lang="en">Silver sintering wire-bonding less power module for high temperature applications</title>
            <author role="aut">
              <persName>
                <forename type="first">Francois</forename>
                <surname>Le Henaff</surname>
              </persName>
              <email type="md5">4558a821946b060636ed4f02b7cb2dc2</email>
              <email type="domain">ims-bordeaux.fr</email>
              <idno type="idhal" notation="numeric">936218</idno>
              <idno type="halauthorid" notation="string">860725-936218</idno>
              <affiliation ref="#struct-24472"/>
            </author>
            <author role="crp">
              <persName>
                <forename type="first">Stephane</forename>
                <surname>Azzopardi</surname>
              </persName>
              <email type="md5">5e04f0f21be47cb111f1657ae848b3de</email>
              <email type="domain">ims-bordeaux.fr</email>
              <idno type="idhal" notation="numeric">841232</idno>
              <idno type="halauthorid" notation="string">217059-841232</idno>
              <affiliation ref="#struct-24472"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Loïc</forename>
                <surname>Théolier</surname>
              </persName>
              <email type="md5">23d1ab0e3aa7caac31c89b7eccdc17c4</email>
              <email type="domain">ims-bordeaux.fr</email>
              <idno type="idhal" notation="string">loic-theolier</idno>
              <idno type="idhal" notation="numeric">16612</idno>
              <idno type="halauthorid" notation="string">22107-16612</idno>
              <idno type="ORCID">https://orcid.org/0000-0002-6149-1849</idno>
              <idno type="IDREF">https://www.idref.fr/139716912</idno>
              <affiliation ref="#struct-24472"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Jean-Yves</forename>
                <surname>Deletage</surname>
              </persName>
              <email type="md5">4b89375b7c004cb67bb9ec4146d8b33c</email>
              <email type="domain">ims-bordeaux.fr</email>
              <idno type="idhal" notation="string">jean-yves-deletage</idno>
              <idno type="idhal" notation="numeric">1168322</idno>
              <idno type="halauthorid" notation="string">237831-1168322</idno>
              <idno type="ORCID">https://orcid.org/0000-0002-8335-0967</idno>
              <affiliation ref="#struct-24472"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Eric</forename>
                <surname>Woirgard</surname>
              </persName>
              <email type="md5">3e760b3c507b4c1fd9da96f60e8854c3</email>
              <email type="domain">u-bordeaux1.fr</email>
              <idno type="idhal" notation="numeric">959966</idno>
              <idno type="halauthorid" notation="string">217058-959966</idno>
              <affiliation ref="#struct-24472"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Serge</forename>
                <surname>Bontemps</surname>
              </persName>
              <email type="md5">92d48df4f9c211134a7191359e538e77</email>
              <email type="domain">microsemi.com</email>
              <idno type="idhal" notation="numeric">936219</idno>
              <idno type="halauthorid" notation="string">510255-936219</idno>
              <affiliation ref="#struct-267052"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Julien</forename>
                <surname>Joguet</surname>
              </persName>
              <email type="md5">039c8a8a83c7ff29963ba1fc12287910</email>
              <email type="domain">alent.com</email>
              <idno type="idhal" notation="numeric">936220</idno>
              <idno type="halauthorid" notation="string">688084-936220</idno>
              <affiliation ref="#struct-267049"/>
            </author>
            <editor role="depositor">
              <persName>
                <forename>CCSD</forename>
                <surname>Sciencesconf.org</surname>
              </persName>
              <email type="md5">2dac992f64ee924a7ad555e53daad36f</email>
              <email type="domain">sciencesconf.org</email>
            </editor>
          </titleStmt>
          <editionStmt>
            <edition n="v1" type="current">
              <date type="whenSubmitted">2014-09-18 10:02:06</date>
              <date type="whenWritten">2000</date>
              <date type="whenModified">2025-03-17 19:32:16</date>
              <date type="whenReleased"/>
              <date type="whenProduced">2014-07-08</date>
              <date type="whenEndEmbargoed">2014-09-18</date>
              <ref type="file" target="https://hal.science/hal-01065293v1/document">
                <date notBefore="2014-09-18"/>
              </ref>
              <ref type="file" subtype="author" n="1" target="https://hal.science/hal-01065293v1/file/SGE2014_Silver_sintering_wire_bonding_less_power_module_.pdf" id="file-1065293-867492">
                <date notBefore="2014-09-18"/>
              </ref>
              <ref type="annex" subtype="other" n="0" target="https://hal.science/hal-01065293v1/file/SGE_2014_silver_sintering_wire_bonding_less_power_module_for_high_temperature_applications.docx" id="file-1065293-867490">
                <date notBefore="2014-09-18"/>
              </ref>
              <ref type="annex" subtype="other" n="0" target="https://hal.science/hal-01065293v1/file/SGE_2014_silver_sintering_wire_bonding_less_power_module_for_high_temperature_applications.pdf" id="file-1065293-867491">
                <date notBefore="2014-09-18"/>
              </ref>
            </edition>
            <respStmt>
              <resp>contributor</resp>
              <name key="167428">
                <persName>
                  <forename>CCSD</forename>
                  <surname>Sciencesconf.org</surname>
                </persName>
                <email type="md5">2dac992f64ee924a7ad555e53daad36f</email>
                <email type="domain">sciencesconf.org</email>
              </name>
            </respStmt>
          </editionStmt>
          <publicationStmt>
            <distributor>CCSD</distributor>
            <idno type="halId">hal-01065293</idno>
            <idno type="halUri">https://hal.science/hal-01065293</idno>
            <idno type="halBibtex">lehenaff:hal-01065293</idno>
            <idno type="halRefHtml">&lt;i&gt;Symposium de Génie Électrique 2014&lt;/i&gt;, Jul 2014, Cachan, France</idno>
            <idno type="halRef">Symposium de Génie Électrique 2014, Jul 2014, Cachan, France</idno>
            <availability status="restricted">
              <licence target="https://about.hal.science/hal-authorisation-v1/">HAL Authorization<ref corresp="#file-1065293-867492"/><ref corresp="#file-1065293-867490"/><ref corresp="#file-1065293-867491"/></licence>
            </availability>
          </publicationStmt>
          <seriesStmt>
            <idno type="stamp" n="CNRS">CNRS - Centre national de la recherche scientifique</idno>
            <idno type="stamp" n="IMS-BORDEAUX">Laboratoire de l'intégration, du matériau au système</idno>
            <idno type="stamp" n="IMS-BORDEAUX-FUSION">Laboratoire de l'intégration, du matériau au système TOUS LABOS</idno>
            <idno type="stamp" n="SGE2014">Symposium de Génie Électrique 2014</idno>
            <idno type="stamp" n="UNIVERSITE-BORDEAUX">Université de Bordeaux</idno>
          </seriesStmt>
          <notesStmt>
            <note type="audience" n="1">Not set</note>
            <note type="invited" n="0">No</note>
            <note type="popular" n="0">No</note>
            <note type="peer" n="1">Yes</note>
            <note type="proceedings" n="0">No</note>
          </notesStmt>
          <sourceDesc>
            <biblStruct>
              <analytic>
                <title xml:lang="en">Silver sintering wire-bonding less power module for high temperature applications</title>
                <author role="aut">
                  <persName>
                    <forename type="first">Francois</forename>
                    <surname>Le Henaff</surname>
                  </persName>
                  <email type="md5">4558a821946b060636ed4f02b7cb2dc2</email>
                  <email type="domain">ims-bordeaux.fr</email>
                  <idno type="idhal" notation="numeric">936218</idno>
                  <idno type="halauthorid" notation="string">860725-936218</idno>
                  <affiliation ref="#struct-24472"/>
                </author>
                <author role="crp">
                  <persName>
                    <forename type="first">Stephane</forename>
                    <surname>Azzopardi</surname>
                  </persName>
                  <email type="md5">5e04f0f21be47cb111f1657ae848b3de</email>
                  <email type="domain">ims-bordeaux.fr</email>
                  <idno type="idhal" notation="numeric">841232</idno>
                  <idno type="halauthorid" notation="string">217059-841232</idno>
                  <affiliation ref="#struct-24472"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Loïc</forename>
                    <surname>Théolier</surname>
                  </persName>
                  <email type="md5">23d1ab0e3aa7caac31c89b7eccdc17c4</email>
                  <email type="domain">ims-bordeaux.fr</email>
                  <idno type="idhal" notation="string">loic-theolier</idno>
                  <idno type="idhal" notation="numeric">16612</idno>
                  <idno type="halauthorid" notation="string">22107-16612</idno>
                  <idno type="ORCID">https://orcid.org/0000-0002-6149-1849</idno>
                  <idno type="IDREF">https://www.idref.fr/139716912</idno>
                  <affiliation ref="#struct-24472"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Jean-Yves</forename>
                    <surname>Deletage</surname>
                  </persName>
                  <email type="md5">4b89375b7c004cb67bb9ec4146d8b33c</email>
                  <email type="domain">ims-bordeaux.fr</email>
                  <idno type="idhal" notation="string">jean-yves-deletage</idno>
                  <idno type="idhal" notation="numeric">1168322</idno>
                  <idno type="halauthorid" notation="string">237831-1168322</idno>
                  <idno type="ORCID">https://orcid.org/0000-0002-8335-0967</idno>
                  <affiliation ref="#struct-24472"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Eric</forename>
                    <surname>Woirgard</surname>
                  </persName>
                  <email type="md5">3e760b3c507b4c1fd9da96f60e8854c3</email>
                  <email type="domain">u-bordeaux1.fr</email>
                  <idno type="idhal" notation="numeric">959966</idno>
                  <idno type="halauthorid" notation="string">217058-959966</idno>
                  <affiliation ref="#struct-24472"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Serge</forename>
                    <surname>Bontemps</surname>
                  </persName>
                  <email type="md5">92d48df4f9c211134a7191359e538e77</email>
                  <email type="domain">microsemi.com</email>
                  <idno type="idhal" notation="numeric">936219</idno>
                  <idno type="halauthorid" notation="string">510255-936219</idno>
                  <affiliation ref="#struct-267052"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Julien</forename>
                    <surname>Joguet</surname>
                  </persName>
                  <email type="md5">039c8a8a83c7ff29963ba1fc12287910</email>
                  <email type="domain">alent.com</email>
                  <idno type="idhal" notation="numeric">936220</idno>
                  <idno type="halauthorid" notation="string">688084-936220</idno>
                  <affiliation ref="#struct-267049"/>
                </author>
              </analytic>
              <monogr>
                <idno type="localRef">Intégration de puissance, assemblage et packaging</idno>
                <meeting>
                  <title>Symposium de Génie Électrique 2014</title>
                  <date type="start">2014-07-08</date>
                  <date type="end">2014-07-10</date>
                  <settlement>Cachan</settlement>
                  <country key="FR">France</country>
                </meeting>
                <imprint/>
              </monogr>
            </biblStruct>
          </sourceDesc>
          <profileDesc>
            <langUsage>
              <language ident="fr">French</language>
            </langUsage>
            <textClass>
              <classCode scheme="halDomain" n="spi.nrj">Engineering Sciences [physics]/Electric power</classCode>
              <classCode scheme="halTypology" n="COMM">Conference papers</classCode>
              <classCode scheme="halOldTypology" n="COMM">Conference papers</classCode>
              <classCode scheme="halTreeTypology" n="COMM">Conference papers</classCode>
            </textClass>
            <abstract xml:lang="en">
              <p>Integrity of the power module is mainly provided by interconnections between the different components. Due to RoHS restrictions, conventional lead-based solders cannot be used anymore. New solutions of die-attach have been investigated such as transient liquid phase bonding or silver sintering which is currently the most advanced alternative technology. Furthermore, the increase of electrification in transportation system requires a high thermal management because power electronics systems can be located in severe thermal environment and have to dissipate high self-heating. Double-side cooling power modules do not use wires bonding anymore, highly responsible for many failures. To match such requirements, a new structure combining silver sintering and double side cooling system has been developed and characterized. A prototype of a wireless single-phase bridge rectifier has been investigated.</p>
            </abstract>
          </profileDesc>
        </biblFull>
      </listBibl>
    </body>
    <back>
      <listOrg type="structures">
        <org type="laboratory" xml:id="struct-24472" status="VALID">
          <idno type="RNSR">200711887V</idno>
          <idno type="ROR">04nabhy78</idno>
          <orgName>Laboratoire de l'intégration, du matériau au système</orgName>
          <orgName type="acronym">IMS</orgName>
          <desc>
            <address>
              <addrLine>33405 TALENCE CEDEX</addrLine>
              <country key="FR"/>
            </address>
            <ref type="url">http://www.ims-bordeaux.fr</ref>
          </desc>
          <listRelation>
            <relation active="#struct-259761" type="direct"/>
            <relation active="#struct-301962" type="direct"/>
            <relation name="UMR5218" active="#struct-441569" type="direct"/>
          </listRelation>
        </org>
        <org type="laboratory" xml:id="struct-267052" status="INCOMING">
          <orgName>Microsemi Power Module Products</orgName>
          <desc>
            <address>
              <addrLine>33520, Bruges, France</addrLine>
              <country key="FR"/>
            </address>
          </desc>
          <listRelation>
            <relation active="#struct-332326" type="direct"/>
          </listRelation>
        </org>
        <org type="laboratory" xml:id="struct-267049" status="INCOMING">
          <orgName>Alpha</orgName>
          <desc>
            <address>
              <addrLine>South Plainfield, New Jersey 07080, USA</addrLine>
              <country key="US"/>
            </address>
          </desc>
          <listRelation>
            <relation active="#struct-363805" type="direct"/>
          </listRelation>
        </org>
        <org type="institution" xml:id="struct-259761" status="VALID">
          <idno type="IdRef">175206562</idno>
          <idno type="ROR">https://ror.org/057qpr032</idno>
          <orgName>Université de Bordeaux</orgName>
          <orgName type="acronym">UB</orgName>
          <desc>
            <address>
              <addrLine>35, place Pey Berland - 33076 Bordeaux</addrLine>
              <country key="FR"/>
            </address>
            <ref type="url">http://www.u-bordeaux.fr/</ref>
          </desc>
        </org>
        <org type="institution" xml:id="struct-301962" status="VALID">
          <idno type="ROR">https://ror.org/054qv7y42</idno>
          <orgName>Institut Polytechnique de Bordeaux</orgName>
          <desc>
            <address>
              <addrLine>146, rue Léo Saignat, 33076 Bordeaux</addrLine>
              <country key="FR"/>
            </address>
          </desc>
        </org>
        <org type="regroupinstitution" xml:id="struct-441569" status="VALID">
          <idno type="IdRef">02636817X</idno>
          <idno type="ISNI">0000000122597504</idno>
          <idno type="ROR">https://ror.org/02feahw73</idno>
          <orgName>Centre National de la Recherche Scientifique</orgName>
          <orgName type="acronym">CNRS</orgName>
          <date type="start">1939-10-19</date>
          <desc>
            <address>
              <country key="FR"/>
            </address>
            <ref type="url">https://www.cnrs.fr/</ref>
          </desc>
        </org>
        <org type="institution" xml:id="struct-332326" status="INCOMING">
          <orgName>MICROSEMI</orgName>
          <desc>
            <address>
              <country key="FR"/>
            </address>
          </desc>
        </org>
        <org type="institution" xml:id="struct-363805" status="INCOMING">
          <orgName>Alpha</orgName>
          <desc>
            <address>
              <country key="FR"/>
            </address>
          </desc>
        </org>
      </listOrg>
    </back>
  </text>
</TEI>