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Article Dans Une Revue Journal of Materials Processing Technology Année : 2015

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

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hal-01065130 , version 1 (18-09-2014)

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Jianfeng Li, Mark Johnson, Cyril Buttay, Wissam Sabbah, Stephane Azzopardi. Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 2015, pp.299-308. ⟨10.1016/j.jmatprotec.2014.08.002⟩. ⟨hal-01065130⟩
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