A new junction termination technique: The Deep Trench Termination (DT²) - Archive ouverte HAL
Communication Dans Un Congrès Année : 2009

A new junction termination technique: The Deep Trench Termination (DT²)

Résumé

Numerous techniques have been used to improve the voltage handling capability of high voltage power devices with the aim to obtain the breakdown of a plane junction. In this work, a new concept of low cost, low surface and high efficiency junction termination for power devices is presented and experimentally validated. This termination is based on a large and deep trench filled by BCB (BenzoCycloButene) associated to a field plate. Simulation results show the important impact of trench design and field plate width on termination performances. The experimental breakdown voltage of this Deep Trench Termination (DT2) is close to 1300 Volts: this value validates not only the concept of the DT2 but also the choice of the BCB as a good dielectric material for this termination.
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Dates et versions

hal-00991573 , version 1 (16-05-2014)

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Loïc Théolier, Hicham Mahfoz-Kotb, Karine Isoird, Frédéric Morancho. A new junction termination technique: The Deep Trench Termination (DT²). 21st International Symposium on Power Semiconductor Devices & IC's (ISPSD), 2009., Jun 2009, Barcelona, Spain. pp.176-179, ⟨10.1109/ISPSD.2009.5158030⟩. ⟨hal-00991573⟩
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