Shock adhesion test for composite bonded assembly using a high pulsed power generator - Archive ouverte HAL
Article Dans Une Revue Journal of Applied Physics Année : 2013

Shock adhesion test for composite bonded assembly using a high pulsed power generator

Résumé

In a context of the rising use of composite assemblies in aeronautic or defense fields, the assessment of their strength is a key issue. The method developed in this study attempts to provide solutions. A shock adhesion test based on short compressive loads, obtained by a high pulsed power generator, is proposed as a proof test to ensure the quality of composite bonded assemblies. A calibrated load induces a local tensile stress able to damage the bond interface. The high pulsed power source is the GEnerateur de Pression Isentropique device (Isentropic Pressure Generator), used to generate the required stresses, with a 450 ns pulse duration to test assemblies above the mm thickness range. The understanding of the mechanisms of wave propagation and tensile stress generation within these multilayer assemblies are scientific challenges. The ability of the technique to induce a tensile stress able to disbond the laminates and the assemblies is demonstrated. This paper details the response of carbon epoxy laminates and their bonded assemblies to a shock loading near the damage threshold.
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Dates et versions

hal-00987470 , version 1 (06-05-2014)

Identifiants

  • HAL Id : hal-00987470 , version 1
  • DOI : 10.1063/1.4811696
  • ENSAM : http://hdl.handle.net/10985/8105

Citer

Elise Gay, Laurent Berthe, Eric Buzaud, Michel Boustié, M. Arrigoni. Shock adhesion test for composite bonded assembly using a high pulsed power generator. Journal of Applied Physics, 2013, 114 (1), pp.013502. ⟨10.1063/1.4811696⟩. ⟨hal-00987470⟩
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