In this paper, we propose the implementation of multiple defect-tolerant techniques on an SRAM-based FPGA. These techniques include redundancy at both the logic block and intra-cluster interconnect. In the logic block, redundancy is implemented at the multiplexer level. Its efficiency is analyzed by injecting a single defect at the output of a multiplexer, considering all possible locations and input combinations. While at the interconnect level, fine grain redundancy is introduced which not only bypasses defects but also increases routability. Taking advantage of the sparse intra-cluster interconnect structures, routability is further improved by efficient distribution of feedback paths allowing more flexibility in the connections among logic blocks. Emulation results show a significant improvement of about 15% and 34% in the robustness of logic block and intra-cluster interconnect respectively. Furthermore, the impact of these hardening schemes on the testability of the FPGA cluster for manufacturing defects is also investigated in terms of maximum achievable fault coverage and the respective cost.