FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2014

FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

Résumé

In this study, Quad Flat No-lead (QFN) cavity package based on LCP and the reliability impact of the package geometry are investigated. A well-established model of Sn96.5Ag3Cu0.5 solder joint fatigue based on the Darveaux's methodology leading to strain energy density estimation is used. A dedicated Design of Experiments (DoE) is performed to assess the optimal thermo-mechanical properties of the LCP package leading to the maximum operating lifetime. A correlation between predicted lifetime results and optimal thermo-mechanical properties of the package is obtained depending on the geometry of the QFN under study.

Domaines

Electronique
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Dates et versions

hal-00979149 , version 1 (15-04-2014)

Identifiants

  • HAL Id : hal-00979149 , version 1

Citer

Walide Chenniki, Isabelle Bord-Majek, Bruno Levrier, Komkrisd Wongtimnoi, Jean-Luc Diot, et al.. FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint. EuroSimE 2014: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2014, Ghent, Belgium. pp.50. ⟨hal-00979149⟩
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