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Communication Dans Un Congrès Année : 2013

Studies on Die-to-Substrate Interconnects for High-Q PCB Inductors

Résumé

Wire-bond, solder ball, and copper pillar are generally utilised as chip-to-substrate interconnects. In this paper, the impact of these types of connections on achievable quality factor of a planar inductor is investigated. A simple and accurate Pimodel of such joints, and mathematical expressions to estimate the model elements are proposed. Results show a good agreement between the model and the EM-simulation results, with inductance accuracy within 10%. At a frequency of 2GHz, simulation results demonstrate that an inductance of 1:26nH with a Q-factor of 154 is achievable on an organic laminate substrate. However, the Q-factor is reduced to 100 when such inductor is connected to a silicon chip via a solder bump flip-chip process. In order to implement and to achieve the required Q-factor, a practical design remedy is introduced

Domaines

Electronique
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Dates et versions

hal-00917035 , version 1 (11-12-2013)

Identifiants

  • HAL Id : hal-00917035 , version 1

Citer

Francois Rivet, M. Pourakbar, L. Linton, M. Faulkner. Studies on Die-to-Substrate Interconnects for High-Q PCB Inductors. ICECS, Dec 2013, ABU DHABI, United Arab Emirates. pp.160-169. ⟨hal-00917035⟩
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