Investigation of the heel crack mechanism in Al connections for power electronics modules - Archive ouverte HAL
Article Dans Une Revue Microelectronics Reliability Année : 2011

Investigation of the heel crack mechanism in Al connections for power electronics modules

Résumé

In power electronic packages, one of the main limiting factors for the module reliability stems from failure of the electrical interconnection which ensures the contact between the chip and the lead frame. The aim of this work is to model, using FEM and some analytical developments, the interconnection heel crack mechanism appearing in service. The forming process impact is particularly evaluated and it is established that the initial residual stresses contribute to limit the wire/ribbon life time.

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Domaines

Electronique

Dates et versions

hal-00879969 , version 1 (05-11-2013)

Identifiants

Citer

Y Celnikier, L Benabou, Laurent Dupont, G Coquery. Investigation of the heel crack mechanism in Al connections for power electronics modules. Microelectronics Reliability, 2011, 51 (5), pp 965-974. ⟨10.1016/j.microrel.2011.01.001⟩. ⟨hal-00879969⟩
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