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Communication Dans Un Congrès Année : 2004

Contact Impedance Characterization of Metallized Particle Column to Copper Strip in High Frequency Domains

A. Senouci
  • Fonction : Auteur
C. Koehler
  • Fonction : Auteur

Résumé

The number of applications using high frequency bands up 10 GHz is in constant progression in various domains (high-speed communication, portable phone, radar...). This demand has been widely extended to connectors in automotive applications. In fact various connectors have been designed and developed in order to be used over a wide range of frequencies from a few MHz to several GHz. Among these connectors, metallized particle interconnects (MPI) used widely in interconnections (ASICs, PCs, workstations ...), constitute an interesting candidate to be developed for high frequency connectors, for frequencies up to 18 GHz. In order to simulate the connector, an MPI column was used as a terminal and compressed between two microstrip lines of copper (PCB). Signal losses measurements in the frequency band 100 MHz to 18 GHz are evaluated as a function of compression force. It was found that the impedance of the system is equivalent to an RCL circuit. By fitting experimental loss data we have analyzed each component and have established the impedance laws.

Domaines

Electronique
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Dates et versions

hal-00871648 , version 1 (10-10-2013)

Identifiants

Citer

A. Senouci, Mohamed Himdi, N. Ben Jemaa, C. Koehler. Contact Impedance Characterization of Metallized Particle Column to Copper Strip in High Frequency Domains. Holm conference, Sep 2004, Seattle, United States. ⟨10.1109/HOLM.2004.1353108⟩. ⟨hal-00871648⟩
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