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Communication Dans Un Congrès Année : 2013

Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing

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hal-00853811 , version 1 (23-08-2013)

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  • HAL Id : hal-00853811 , version 1

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L. Meinshausen, K. Weide-Zaage, Hélène Fremont. Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on, Apr 2013, Poland. pp 1-7. ⟨hal-00853811⟩
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