Evolution of interfacial dislocation network during anisothermal high-temperature creep of a nickel-based superalloy - Archive ouverte HAL
Article Dans Une Revue Scripta Materialia Année : 2011

Evolution of interfacial dislocation network during anisothermal high-temperature creep of a nickel-based superalloy

Résumé

The effect of thermal cycling creep on the dislocation networks at the γ/γ′ interfaces in the MC2 superalloy is investigated. Tensile creep tests were performed under thermal cycling and isothermal conditions at low stress (80 MPa) and high temperature (1150 °C). In these conditions γ′ rafts may dissolve and reprecipitate during thermal cycling creep. The difference between the effects of isothermal and thermal cycling conditions on the γ/γ′ interface dislocation networks, characterized by transmission electron microscopy, is exposed, as well as their evolution during the cycle.
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Dates et versions

hal-00812030 , version 1 (11-04-2013)

Identifiants

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Muriel Hantcherli, Florence Pettinari-Sturmel, Bernard Viguier, Joël Douin, Armand Coujou. Evolution of interfacial dislocation network during anisothermal high-temperature creep of a nickel-based superalloy. Scripta Materialia, 2011, vol. 66, pp. 143-146. ⟨10.1016/j.scriptamat.2011.10.022⟩. ⟨hal-00812030⟩
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