Co-Simulation of Functional SystemC TLM Models with Power/Thermal Solvers - Archive ouverte HAL
Communication Dans Un Congrès Année : 2013

Co-Simulation of Functional SystemC TLM Models with Power/Thermal Solvers

Tayeb Bouhadiba
  • Fonction : Auteur
  • PersonId : 850287
Matthieu Moy
Florence Maraninchi
Jérôme Cornet
  • Fonction : Auteur
  • PersonId : 849247
Laurent Maillet-Contoz
  • Fonction : Auteur
  • PersonId : 845441
Ilija Materic
  • Fonction : Auteur

Résumé

Modern systems-on-chips need sophisticated power-management policies to control their power consumption and temperature. These power-management policies are usually implemented partly in software, with hardware support. They need to be validated early, hence power and temperature-aware simulation techniques at the system-level need to be developed. Existing approaches for system-level power and thermal analysis usually either completely abstract the functionality (allowing only simple scenarios to be simulated), or run the functional simulation independently from the non-functional one. The approach presented in this paper allows a coupled simulation of a SystemC/TLM model, possibly including the actual embedded software, with a power and temperature solver such as ATMI or the commercial tool ACEplorer. Power and temperature analysis is done based on the stimuli sent by the SystemC/TLM platform, which in turn can take decisions based on the non-functional simulation.
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Dates et versions

hal-00807354 , version 1 (03-04-2013)

Identifiants

  • HAL Id : hal-00807354 , version 1

Citer

Tayeb Bouhadiba, Matthieu Moy, Florence Maraninchi, Jérôme Cornet, Laurent Maillet-Contoz, et al.. Co-Simulation of Functional SystemC TLM Models with Power/Thermal Solvers. Virtual Prototyping of Parallel and Embedded Systems (VIPES), May 2013, Boston, United States. ⟨hal-00807354⟩
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